| Jul 2004 |
GET incorporated |
| Apr 2005 |
Start Production with 25MW |
| May 2005 |
First Ingot |
| Jul 2005 |
125mm x 125mm x 0.325mm wafer |
| Aug 2005 |
0.270mm wafer |
| Sep 2005 |
156mm x 15m6m x 0.270mm wafer |
| Jan 2006 |
240um wafer |
| Jul 2006 |
220um wafer |
| Aug 2006 |
Expansion to 50 MW |
| Nov 2006 |
Expansion to 65 MW |
| Jan 2007 |
180um wafer capability verified |
| Feb 2007 |
Restart production with 37 MW capacity |
| Mar 2007 |
Capacity up to 82 MW |
| May 2007 |
Capacity up to 115 MW |
| Jun 2007 |
Thin-Film project kick-off |
| Dec 2007 |
TF plant ground breaking |
| Jan 2008 |
Muti-crystalline wafer size upgrades from 156x156x200um to 180um |
| Jun 2008 |
Wafer annual capacity up-scales to 200MW |
